zangtumtum
Well-Known Member
It was never "found" the graph of CXA/CXB 3070 - 90CRI?
C.O.B.S.S.L. News and Articles
- Thread starter stardustsailor
- Start date
alesh
Well-Known Member
Where does the chart come from?
Mainlinekush
Well-Known Member
Hey man thanks very much it was a lot of planning to make it look nice and work to its abilities. It's a 1/4 plexi glass. I Planned on putting logos on side but ended up putting them on top.
FranJan
Well-Known Member
COB INFO:
Some interesting going ons I think. If Flip Chip Opto ever got their hands on tech like these they could really make a helluva grow light.
The Future's So Bright........ I Gotta Wear Shades
.
Some interesting going ons I think. If Flip Chip Opto ever got their hands on tech like these they could really make a helluva grow light.
Litecool Turns LED Packaging on Its Side
http://www.led-professional.com/technology/thermal-management/litecool-turns-led-packaging-on-its-side
"Litecool has produced LED packages in a vertical orientation rather than horizontal. This means that the dielectric layers only have a minor impact on the thermal performance of the LED package and allow the heat to escape more effectively through the metallic parts of the package. This has significant benefits for flip-chip packaging where dielectric layers are usually very close to the diode.
Litecool's new packaging concept significantly reduces the thermal resistance of LED packages by using a vertical dielectric..."
http://www.palomartechnologies.com/applications/chip-on-board
"Chip-on-Board, or COB, applications consist of die directly attached to its circuit board. COB assemblies improve package performance as a result of the shorter interconnection paths and are a preferred application by process engineers.
COB technology is actually 'direct chip attachment', or DCA. Direct Chip Attachment assemblies can be called different names depending on substrate material. For example chip-on-glass (COG), chip-on-flex (COF), among others.
The COB process often has 3 steps:
1.Die attach
2.Wire bonding
3.Encapsulation of the die and wires
The flip chip process incorporated with COB enables successful attachment without using wire bonding; it does so by bumping the bond pads on the correct side (via flipping the chip) and directly attaching the chip. With Flip Chip on Board (FCOB), underfilling the chip is required to protect the chip's active surface from damage."
http://www.led-professional.com/technology/thermal-management/litecool-turns-led-packaging-on-its-side
"Litecool has produced LED packages in a vertical orientation rather than horizontal. This means that the dielectric layers only have a minor impact on the thermal performance of the LED package and allow the heat to escape more effectively through the metallic parts of the package. This has significant benefits for flip-chip packaging where dielectric layers are usually very close to the diode.
Litecool's new packaging concept significantly reduces the thermal resistance of LED packages by using a vertical dielectric..."
http://www.palomartechnologies.com/applications/chip-on-board
"Chip-on-Board, or COB, applications consist of die directly attached to its circuit board. COB assemblies improve package performance as a result of the shorter interconnection paths and are a preferred application by process engineers.
COB technology is actually 'direct chip attachment', or DCA. Direct Chip Attachment assemblies can be called different names depending on substrate material. For example chip-on-glass (COG), chip-on-flex (COF), among others.
The COB process often has 3 steps:
1.Die attach
2.Wire bonding
3.Encapsulation of the die and wires
The flip chip process incorporated with COB enables successful attachment without using wire bonding; it does so by bumping the bond pads on the correct side (via flipping the chip) and directly attaching the chip. With Flip Chip on Board (FCOB), underfilling the chip is required to protect the chip's active surface from damage."
The Future's So Bright........ I Gotta Wear Shades
.
FranJan
Well-Known Member
COB News and Info
In addition, Samsung LED’s new Small LES COB packages are built with advanced flip chip technology that enables them to deliver high reliability with low droop, under high current and high thermal conditions. The new Small LES COB lineup features high-efficacy levels of 110lm/W at 3000K CCT, CRI80+, 85°C.
COB LED Packages with Ultra-high Color Rendering
Vivid COB Packages
Moreover, Samsung now provides worldwide certification support to LED lighting component customers. Since January, Samsung has established cooperative relationships with certification companies such as Intertek, Korea Testing Laboratory (KTL), TÜV SÜD and China Certification & Inspection Group Korea (CCIC KOREA) for the US, Korean , European, and Chinese markets, respectively. These partnerships will help to minimize any difficulties that customers could encounter with varying regional certification requirements for lighting quality, safety and power efficiency, as well as simplify complex procedures, reduce time-to-market and ultimately have a positive impact on overall cost.
Sadly I couldn't find any data sheets on Samsung's site but I'll keep plugging. I like the concept of multiple smaller COBs making up a panel for the smaller grower.
Samsung’s COB LED Packages with Superior Color Quality
http://www.led-professional.com/products/leds_led_modules/samsung2019s-cob-led-packages-with-superior-color-quality
Sep 17, 2015
Samsung’s COB LED Packages with Superior Color Quality
Samsung’s new chip-on-board (COB) LED package lineups with industry-leading color quality include small LES (light-emitting surface) COB packages, high CRI (color rendering index) COBs, and vivid COBs. The new COB packages, with their outstanding color quality and scaled-down light- emitting space requirements, will provide a major design alternative for LED lighting makers.http://www.led-professional.com/products/leds_led_modules/samsung2019s-cob-led-packages-with-superior-color-quality
Sep 17, 2015
Samsung’s COB LED Packages with Superior Color Quality
“By expanding our COB package lineup, we are providing greater value to the LED lighting market, while giving our customers much more design flexibility with which to address market needs,” said Jacob Tarn, Executive Vice President, LED Lighting Business Team, Samsung Electronics. “Samsung is continuing to introduce well-differentiated LED components to meet our customers’ needs, while strengthening our presence in the LED marketplace.”
Small LES COB LED Packages
Small LES COB LED Packages
Samsung LED’s new Small LES COB packages – LC010C, LC020C and LC040C – offer 10W, 20W and 40W of operating wattage options respectively and significantly reduced LES. For the 40W-class LC040C, the diameter of Samsung’s LES has shrunk to 11mm from the 17mm typically specified in conventional 40W COB packages. For the LC010C and LC020C offerings, the LES scaled to 6 mm from 11 mm and to 8 mm from 12.4 mm, respectively. These LES packages are approximately 35 percent smaller than the LES in most existing COB packages available today. Moreover, they offer exceptionally high light intensity and even higher Center Beam Candle Power (CBCP) to provide the optimal narrow-beam solution for spotlights.
In addition, Samsung LED’s new Small LES COB packages are built with advanced flip chip technology that enables them to deliver high reliability with low droop, under high current and high thermal conditions. The new Small LES COB lineup features high-efficacy levels of 110lm/W at 3000K CCT, CRI80+, 85°C.
COB LED Packages with Ultra-high Color Rendering
Samsung’s newly introduced COB LED packages offer high color-rendering with a CRI value of over 95. The high color rendering packages faithfully reveal the true colors of various objects with excellent color index distribution, and are used mainly for commercial LED lighting, which needs to present the color of goods in their most natural state. The high-color-quality COB packages support CCT (Correlated Color Temperature) specifications between 2700K and 3500K. Samsung’s ultra-high-CRI lineup is now available.
Vivid COB Packages
Samsung’s new Vivid COB packages feature much more brilliant colors than virtually any commercial LED light, making objects appear as attractive as possible to the human eye. This feature is based on the Vivid COB packages’ color spectrum tuning and phosphor controlling. As a result, the package helps depict objects much more clearly with intense levels of color saturation.
Moreover, Samsung now provides worldwide certification support to LED lighting component customers. Since January, Samsung has established cooperative relationships with certification companies such as Intertek, Korea Testing Laboratory (KTL), TÜV SÜD and China Certification & Inspection Group Korea (CCIC KOREA) for the US, Korean , European, and Chinese markets, respectively. These partnerships will help to minimize any difficulties that customers could encounter with varying regional certification requirements for lighting quality, safety and power efficiency, as well as simplify complex procedures, reduce time-to-market and ultimately have a positive impact on overall cost.
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Sadly I couldn't find any data sheets on Samsung's site but I'll keep plugging. I like the concept of multiple smaller COBs making up a panel for the smaller grower.
Greengenes707
Well-Known Member
"color spectrum tuning and phosphor controlling" sounds pretty good to me.